Indata - Termiska

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C_TEMPERATURE, Generated and attached to a reference designator (component). Defines the case temperature for the component in degrees centigrade.

J_TEMPERATURE, Attached to a reference designator (component). Defines the junction temperature for the component in degrees centigrade.

RATED_MAX_TEMP, Attach to a device (through a device file). The nominal operating temperature of a device in degrees centigrade.

T_TEMPERATURE, Generated by Thermax and attached to a reference designator (component). Defines the case top temperature for the component in degrees centigrade.

thermal analysis
An Allegro/APD option that lets you analyze the thermal conditions resulting from current design placement and the boundary conditions you specify, and retrieve junction and case temperatures (J_TEMPERATURE and C_TEMPERATURE property values) for the components in the design.

thermal shift
A temperature-induced change in operating voltage. A silicon junction at room temperature operates at 0.6 volts. This value increases about 2 millivolts for every 1C of junction temperature rise. The junction temperature difference between driver and receiver is responsible for thermal shift in logic devices.

hot spot
A spot of color at the center of each component. The color of the hot spot indicates the operating temperature range of the associated component.