High-speed design/HDI

  • Allocate more time for component placement and sub optimizations.
  • Plan your layer build up for impedance adaptation and chosen micro via technology.
  • Transmission properties steers component placement and layout more than production or thermal properties (which have to be met eventually).
  • Co-operate with the PCB-manufacturer about material and technology build up, so that these issues are addressed before manufacturing.

Let your designers do what they do best, and I will take care of the PCB Design.